Direct-to-Chip and Immersion Cooling: Thermal Management Solutions Enabling Edge AI Infrastructure

Last updated: April 26, 2026 Quick Answer: Direct-to-chip and immersion cooling are liquid-based thermal management technologies that remove heat directly from high-power AI accelerators, achieving Power Usage Effectiveness (PUE) as low as 1.02–1.15 compared to 1.4–1.6 for traditional air cooling.

Last updated: April 26, 2026 Quick Answer: Direct-to-chip and immersion cooling are liquid-based thermal management technologies that remove heat directly from high-power AI accelerators, achieving Power Usage Effectiveness (PUE) as low as 1.02–1.15 compared to 1.4–1.6 for traditional air cooling.